Analysis, Design, and Prototyping of Temperature Resilient Clock Distribution Networks for 3-D ICs

Keyphrases

• Analysis Design 100%
• 3D IC 100%
• Clock Distribution Network 100%
• Temperature Resilient 100%
• Temperature Gradient 66%
• System Performance 66%
• Temperature Effect 33%
• Array-based 33%
• Signal Integrity 33%
• Power Density 33%
• Thermal Gradient 33%
• Thermal Density 33%
• Power Efficient 33%
• Compensation Method 33%
• Digital Systems 33%
• Clock Signal 33%
• Power Integrity 33%
• Field Programmable Gate Array 33%
• Increased Power 33%
• Power Distribution Network 33%
• Thermoelectrical 33%

Engineering

• Design Analysis 100%
• Integrated Circuit 100%
• Thermal Gradient 100%
• Clock Distribution Network 100%
• Systems Performance 66%
• Temperature Gradients 66%
• Power Distribution 33%
• Field Programmable Gate Arrays 33%
• Thermoelectricity 33%
• Digital System 33%
• Test Vehicle 33%
• Clock Signal 33%
• Distribution Network 33%