Analysis of a laser process for permanently degrading a photo-activated adhesive joint

Mahesh Mantena, Arnau Piza Cloquell, Edward C. De Meter

Research output: Contribution to journalArticlepeer-review

3 Scopus citations


A pulsed, laser process has been developed to reduce the permanent strength of photo-activated adhesive joints prior to work-piece de-bonding. The objective of this investigation was to gain insight into the relationships between carbon black content of the adhesive, laser delivery mode, heat transfer, and adhesive degradation. To do so, a variety of experiments were performed to characterize process sensitivity, radiation absorption within the adhesive joint, and thermal decomposition of the adhesive. In addition, heat transfer analysis was conducted to predict adhesive temperatures during the process. The results of this investigation indicate that the strength diminishment of an adhesive joint occurs after it has absorbed a train of high power pulses in rapid succession. The vast majority of strength diminishment occurs over a very narrow time window and is highly correlated to the rapid emission of gray smoke/vapor from the adhesive joint. For this to occur, the adhesive must contain carbon black. It is also highly correlated to a rapid increase in temperatures throughout the adhesive matrix. Laser pulse parameters that do not lead to this rapid increase, will not initiate adhesive degradation. The inclusion of carbon black into the adhesive promotes heat absorption and increased temperatures in the adhesive joint. These temperatures are large enough to enable adhesive decomposition. But the time span over which this happens is too small for significant damage to occur. It is currently hypothesized that high temperatures local to the carbon black particles may be the source of adhesive degradation.

Original languageEnglish (US)
Pages (from-to)190-199
Number of pages10
JournalJournal of Manufacturing Processes
Issue number2
StatePublished - Apr 2014

All Science Journal Classification (ASJC) codes

  • Strategy and Management
  • Management Science and Operations Research
  • Industrial and Manufacturing Engineering


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