Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions

Ki Jin Han; Madhavan Swaminathan; Ege Engin

doi:10.1109/SPI.2008.4558394

Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions

Ki Jin Han, Madhavan Swaminathan, Ege Engin

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.

Original language	English (US)
Title of host publication	12th IEEE Workshop on Signal Propagation on Interconnects, SPI
DOIs	https://doi.org/10.1109/SPI.2008.4558394
State	Published - 2008
Event	12th IEEE Workshop on Signal Propagation on Interconnects, SPI - Avignon, France Duration: May 12 2008 → May 15 2008

Publication series

Name	12th IEEE Workshop on Signal Propagation on Interconnects, SPI

Conference

Conference	12th IEEE Workshop on Signal Propagation on Interconnects, SPI
Country/Territory	France
City	Avignon
Period	5/12/08 → 5/15/08

All Science Journal Classification (ASJC) codes

Signal Processing
Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1109/SPI.2008.4558394

Cite this

Han, K. J., Swaminathan, M., & Engin, E. (2008). Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions. In 12th IEEE Workshop on Signal Propagation on Interconnects, SPI Article 4558394 (12th IEEE Workshop on Signal Propagation on Interconnects, SPI). https://doi.org/10.1109/SPI.2008.4558394

@inproceedings{cdf7672a2127407ab3ea2f4e62c94da2,

title = "Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions",

abstract = "To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.",

author = "Han, {Ki Jin} and Madhavan Swaminathan and Ege Engin",

year = "2008",

doi = "10.1109/SPI.2008.4558394",

language = "English (US)",

isbn = "9781424423187",

series = "12th IEEE Workshop on Signal Propagation on Interconnects, SPI",

booktitle = "12th IEEE Workshop on Signal Propagation on Interconnects, SPI",

note = "12th IEEE Workshop on Signal Propagation on Interconnects, SPI ; Conference date: 12-05-2008 Through 15-05-2008",

}

Han, KJ, Swaminathan, M & Engin, E 2008, Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions. in 12th IEEE Workshop on Signal Propagation on Interconnects, SPI., 4558394, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, Avignon, France, 5/12/08. https://doi.org/10.1109/SPI.2008.4558394

Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions. / Han, Ki Jin; Swaminathan, Madhavan; Engin, Ege.
12th IEEE Workshop on Signal Propagation on Interconnects, SPI. 2008. 4558394 (12th IEEE Workshop on Signal Propagation on Interconnects, SPI).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions

AU - Han, Ki Jin

AU - Swaminathan, Madhavan

AU - Engin, Ege

PY - 2008

Y1 - 2008

N2 - To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.

AB - To clarify the initial step of 3-D interconnection design, this paper shows electrical characteristics of vertically and horizontally coupled bonding wire interconnections. For efficient analysis, solving EFIE with cylindrical CMBF is used, and additional approximation methods and matrix manipulation are discussed.

UR - http://www.scopus.com/inward/record.url?scp=51849123859&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=51849123859&partnerID=8YFLogxK

U2 - 10.1109/SPI.2008.4558394

DO - 10.1109/SPI.2008.4558394

M3 - Conference contribution

AN - SCOPUS:51849123859

SN - 9781424423187

T3 - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI

BT - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI

T2 - 12th IEEE Workshop on Signal Propagation on Interconnects, SPI

Y2 - 12 May 2008 through 15 May 2008

ER -

Analysis of horizontal and vertical couplings in bonding wire interconnections using EFIE with cylindrical conduction mode basis functions

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