Abstract
This paper discusses the multi-input and multi-output transmission matrix method for analyzing multi-layered rectangular and irregular shaped power distribution networks connected through vertical vias modeled as partial self and mutual inductors in the frequency domain. Using the transmission matrix method, via effects and the effects of multiple rectangular power/ground plane pairs without and with decoupling capacitors are analyzed.
| Original language | English (US) |
|---|---|
| Pages | 207-210 |
| Number of pages | 4 |
| State | Published - 2001 |
| Event | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States Duration: Oct 29 2001 → Oct 31 2001 |
Conference
| Conference | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Cambridge, MA |
| Period | 10/29/01 → 10/31/01 |
All Science Journal Classification (ASJC) codes
- General Engineering