Analytical exploration of conduction power losses for stacked multicell converters

Vahid Dargahi, Arash Khoshkbar Sadigh, Keith Corzine

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The multilevel inverters are predominantly applied for medium/high-voltage high-power industrial applications. The stacked multicell (SM) converter is one of the promising derived-topologies from flying-capacitor-multicell (FCM) converter which has an increased performance. Discerning that conduction power loss exploration is a beneficial procedure in design phase of the multilevel inverter, this study suggests an analytical method for computation of the conduction power losses in SM converters. To achieve this, formulas are derived on the basis of SM converter modulation index, power factor, and load peak current for computation of rms and average currents flowing through power switches like as IGBT and freewheeling diode. The numerical results of the derived equations for computation of the rms and average currents flowing through IGBTs and freewheeling diodes are compared with simulation results. Numerical computations matched simulation results which validates the derived formulas. Then, proposed closed-form solutions for analytical computation of the rms and average currents are utilized to calculate the conduction power losses in a 12.4-MVA 3.3-kV 9-level (line-to-line) SM converter at a specific junction temperature. For this purpose, a 2.5-kV 1.5-kA IGBT module from ABB is considered as a power switch.

Original languageEnglish (US)
Title of host publication2017 IEEE Applied Power Electronics Conference and Exposition, APEC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1054-1061
Number of pages8
ISBN (Electronic)9781509053667
DOIs
StatePublished - May 17 2017
Event32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017 - Tampa, United States
Duration: Mar 26 2017Mar 30 2017

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Conference

Conference32nd Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2017
Country/TerritoryUnited States
CityTampa
Period3/26/173/30/17

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Analytical exploration of conduction power losses for stacked multicell converters'. Together they form a unique fingerprint.

Cite this