Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications

This work presents the implementation and characterization of a die-embedded, antenna-integrated glass package for RF modules in D-Band. The proposed package uses glass as the core material which can match the coefficient-of-thermal-expansion (CTE) well for RF chips and printed circuit board (PCB). The redistribution layer (RDL) for electrical connections is built on low-loss polymeric build-up dielectric films (ABF-GL102). Dummy dies are embedded in the glass cavities for characterization. The interconnects between die pads and the package are implemented using micro-vias. An 8-elements series-fed microstrip patch antenna is also integrated on the low-loss RDL. The proposed glass panel embedded package addresses the electrical loss and parasitic from the interconnects. With micro-vias and transmission lines built on low-loss RDL, the glass embedded package provides low-loss and low-parasitic chip-to-chip and chip-to-antenna interconnects. Using temporary thermal release tapes, this package also shows great potential to address the high heat dissipation from D-band power amplifiers.