Antenna With Embedded Die in Glass Interposer for 6G Wireless Applications

Xiaofan Jia, Xingchen Li, Serhat Erdogan, Kyoung Sik Moon, Joon Woo Kim, Kai Qi Huang, Matthew B. Jordan, Madhavan Swaminathan

Research output: Contribution to journalArticlepeer-review

3 Citations (SciVal)


This article presents the antenna-integrated glass interposer for $D$ -band 6G wireless applications using die-embedding technology. We implement the die-embedded package on glass substrates and characterize the electrical performance in the $D$ -band. The electrical characterization employs embedded test dies with the 50- $\Omega $ ground-signal-ground (GSG) ports and coplanar waveguides. We achieve low-loss die-to-package transitions by using staggered dielectric vias, which are compared with the transitions of wire-bonding and flip-chip assembly. This article provides detailed information on the design, modeling, fabrication, and characterization of the die-to-package interconnects. This article also demonstrates the integration of microstrip patch antenna array and embedded dies in the $D$ -band. The results show superior electrical performance provided by the die-embedded glass interposer. The die-to-package interconnect exhibits good matching (less than -10-dB S11) and low loss (0.2-dB loss) in the $D$ -band. The integrated $1\times8$ patch antenna array shows 11.6-dB broadside gain and good matching with the embedded die. In addition, by using a temporary carrier, the antenna-integrated glass interposer also has great potential for further heterogeneous integration and thermal management.

Original languageEnglish (US)
Pages (from-to)219-229
Number of pages11
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number2
StatePublished - Feb 1 2023

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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