Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling

David C. Zhang; Madhavan Swaminathan; David Keezer

doi:10.1109/TCPMT.2015.2431191

Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling

David C. Zhang, Madhavan Swaminathan, David Keezer

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

9 Scopus citations

Abstract

This paper presents a new power distribution scheme using power transmission lines (PTLs) applied to complex printed circuit boards. The structure consists of three daughter cards stacked on a motherboard where the board-board connectors used for connection are highly inductive. We show that in spite of the inductive connections, good signal integrity (SI) and power integrity (PI) are possible without relying too much on decoupling capacitors. This is achieved using a combination of PTL that replaces the voltage planes and current steering techniques. The PTL scheme described in this paper can be used for high-speed digital signaling. The SI and PI are demonstrated for up to 3-Gbit/s transmission between the boards.

Original language	English (US)
Article number	7118162
Pages (from-to)	806-817
Number of pages	12
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	5
Issue number	6
DOIs	https://doi.org/10.1109/TCPMT.2015.2431191
State	Published - Jun 1 2015

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Industrial and Manufacturing Engineering
Electrical and Electronic Engineering

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10.1109/TCPMT.2015.2431191

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title = "Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling",

abstract = "This paper presents a new power distribution scheme using power transmission lines (PTLs) applied to complex printed circuit boards. The structure consists of three daughter cards stacked on a motherboard where the board-board connectors used for connection are highly inductive. We show that in spite of the inductive connections, good signal integrity (SI) and power integrity (PI) are possible without relying too much on decoupling capacitors. This is achieved using a combination of PTL that replaces the voltage planes and current steering techniques. The PTL scheme described in this paper can be used for high-speed digital signaling. The SI and PI are demonstrated for up to 3-Gbit/s transmission between the boards.",

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Application of a New Power Distribution Scheme for Complex Printed Circuit Boards for High-Speed Signaling

Abstract

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