Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
- Ronald J. Warzoha
- , Adam A. Wilson
- , Brian F. Donovan
- , Nazli Donmezer
- , Ashutosh Giri
- , Patrick E. Hopkins
- , Sukwon Choi
- , Darshan Pahinkar
- , Jingjing Shi
- , Samuel Graham
- , Zhiting Tian
- , Laura Ruppalt
Research output: Contribution to journal › Article › peer-review
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