Abstract
In the near future the laser source will be used to full effect in microfabrication. The spectral brightness of the excimer laser will probably propel it to a position as the dominant source for lithography. This will be implemented at the ArF 193 nm wavelength, perhaps to dimensions as small as 0.15 μm in a production environment. In addition, a second technology, laser direct writing, will take on important strategic applications for circuit prototyping and postfabrication (final step) processing. The former technology is posed as a simpler, faster, and less expensive alternative to X-ray, electron-beam, or ion beam lithography for fabricating next generation VLSI. The latter would make methods available for real-time interactive circuit design and will become an enabling technology for multichip modules and three-dimensional micromechanics.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 12-24 |
| Number of pages | 13 |
| Journal | Applied Surface Science |
| Volume | 79-80 |
| Issue number | C |
| DOIs | |
| State | Published - May 2 1994 |
All Science Journal Classification (ASJC) codes
- General Chemistry
- Condensed Matter Physics
- General Physics and Astronomy
- Surfaces and Interfaces
- Surfaces, Coatings and Films