Architecture, chip, and package co-design flow for 2.5D IC design enabling heterogeneous IP reuse
- Jinwoo Kim
- , Gauthaman Murali
- , Heechun Park
- , Eric Qin
- , Hyoukjun Kwon
- , Venkata Chaitanya
- , Krishna Chekuri
- , Nihar Dasari
- , Arvind Singh
- , Minah Lee
- , Hakki Mert Torun
- , Kallol Roy
- , Madhavan Swaminathan
- , Saibal Mukhopadhyay
- , Tushar Krishna
- , Sung Kyu Lim
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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