Original language | English (US) |
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Article number | v001t00a001 |
Journal | Proceedings of ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 |
DOIs | |
State | Published - 2022 |
Event | ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2022 - Garden Grove, United States Duration: Oct 25 2022 → Oct 27 2022 |
All Science Journal Classification (ASJC) codes
- Hardware and Architecture
- Electrical and Electronic Engineering