Assessing and improving bonding in wet conditions

K. T. Tan; C. C. White; D. L. Hunston; B. D. Vogt; A. P. Haag

doi:10.1533/9781845698058.4.547

Assessing and improving bonding in wet conditions

K. T. Tan, C. C. White, D. L. Hunston, B. D. Vogt, A. P. Haag

Chemical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Chapter

2 Scopus citations

Abstract

Moisture is a key culprit in degrading adhesive bonds. This chapter reviews recent developments in test methods and techniques that have been used to assess and understand the role moisture plays in bond degradation, placing emphasis on accelerated destructive aging and testing, as well as non-destructive evaluation. Current understanding of interfacial water accumulation and advances in techniques for quantifying interfacial water distribution and diffusion are discussed. Finally, progress in surface pretreatment techniques, modification of bulk properties, engineering of novel biological adhesives and joint design considerations for improving adhesive bonds in wet conditions are presented.

Original language	English (US)
Title of host publication	Advances in Structural Adhesive Bonding
Publisher	Elsevier Inc.
Pages	547-573
Number of pages	27
ISBN (Print)	9781845694357
DOIs	https://doi.org/10.1533/9781845698058.4.547
State	Published - Mar 2010

All Science Journal Classification (ASJC) codes

General Engineering

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10.1533/9781845698058.4.547

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AU - White, C. C.

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AU - Vogt, B. D.

AU - Haag, A. P.

PY - 2010/3

Y1 - 2010/3

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AB - Moisture is a key culprit in degrading adhesive bonds. This chapter reviews recent developments in test methods and techniques that have been used to assess and understand the role moisture plays in bond degradation, placing emphasis on accelerated destructive aging and testing, as well as non-destructive evaluation. Current understanding of interfacial water accumulation and advances in techniques for quantifying interfacial water distribution and diffusion are discussed. Finally, progress in surface pretreatment techniques, modification of bulk properties, engineering of novel biological adhesives and joint design considerations for improving adhesive bonds in wet conditions are presented.

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BT - Advances in Structural Adhesive Bonding

PB - Elsevier Inc.

ER -

Assessing and improving bonding in wet conditions

Abstract

All Science Journal Classification (ASJC) codes

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