TY - GEN
T1 - Augmented finite element method (AFEM) for the linear steady-state thermal and thermomechanical analysis of heterogeneous integration architectures
AU - Avula, Venkatesh
AU - Smet, Vanessa
AU - Joshi, Yogendra
AU - Swaminathan, Madhavan
N1 - Funding Information:
This work was supported in part by ASCENT, one of six centers in JUMP, a Semiconductor Research Corporation (SRC) program sponsored by DARPA.
Publisher Copyright:
© 2021 IEEE
PY - 2021
Y1 - 2021
N2 - The thermal and thermomechanical reliability analysis of a package is often performed under cyclic loading conditions. An enhanced finite element method to efficiently solve for the steady-state temperature and stress responses arising out of such analysis is presented in this paper. It belongs to and extends the harmonic balance finite element method (HBFEM) technique for the case of a periodic switched linear (PSL) system. The method captures the periodic time-varying nature in the spectral domain. By relying on the time-invariant basis, the method addresses the time-scale and coupling challenges that exist with the traditional time-domain methods for the multiphysics modeling and analysis of the electronic packages. Its computational efficiency is verified on the power-cyclic thermal and thermomechanical analysis of a panel-embedded package.
AB - The thermal and thermomechanical reliability analysis of a package is often performed under cyclic loading conditions. An enhanced finite element method to efficiently solve for the steady-state temperature and stress responses arising out of such analysis is presented in this paper. It belongs to and extends the harmonic balance finite element method (HBFEM) technique for the case of a periodic switched linear (PSL) system. The method captures the periodic time-varying nature in the spectral domain. By relying on the time-invariant basis, the method addresses the time-scale and coupling challenges that exist with the traditional time-domain methods for the multiphysics modeling and analysis of the electronic packages. Its computational efficiency is verified on the power-cyclic thermal and thermomechanical analysis of a panel-embedded package.
UR - https://www.scopus.com/pages/publications/85123565609
UR - https://www.scopus.com/inward/citedby.url?scp=85123565609&partnerID=8YFLogxK
U2 - 10.1109/ITherm51669.2021.9503131
DO - 10.1109/ITherm51669.2021.9503131
M3 - Conference contribution
AN - SCOPUS:85123565609
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 947
EP - 953
BT - Proceedings of the 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021
PB - IEEE Computer Society
T2 - 20th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2021
Y2 - 1 June 2021 through 4 June 2021
ER -