Automated I/O library generation for interposer-based system-in-package integration of multiple heterogeneous dies

Minah Lee, Arvind Singh, Hakki Mert Torun, Jinwoo Kim, Sung Kyu Lim, Madhavan Swaminathan, Saibal Mukhopadhyay

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

System-in-package (SiP) integration of multiple dies in a single package can achieve much higher performance than onboard integration of integrated circuits (ICs) while reducing the design cost/effort compared to a large system on chips (SoCs). However, a major challenge in the design of SiPs with many dies is automated design and insertion of input/output (I/O) cells to minimize energy and delay of the wire traces. This article presents an automated cell library generation flow for all-digital I/O circuits for SiP integration. Given parameterized models of SiP wire traces, our method automatically designs, optimizes, and generates layouts of I/O cells for delay/energy minimization. The proposed flow is demonstrated on interposer-based SiP integration considering 28-nm CMOS technology and 65-nm BEOL technology. Given a multidie SiP design and associated interposer wire traces, this article demonstrates that automated I/O library cell generation can reduce the maximum die-to-die communication delay or energy. We demonstrate the proposed flow for various interposer parameters and SiP designs to show the feasibility of chip-interposer codesign.

Original languageEnglish (US)
Article number8901409
Pages (from-to)111-122
Number of pages12
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume10
Issue number1
DOIs
StatePublished - Jan 2020

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Automated I/O library generation for interposer-based system-in-package integration of multiple heterogeneous dies'. Together they form a unique fingerprint.

Cite this