Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM

Krishna Bharath, Ege Engin, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Scopus citations


In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This is to reduce the simultaneous switching noise (SSN), generated due to the switching activity of digital drivers. Typically this reduction in impedance is accomplished by placing decoupling capacitors between the power and ground planes of a package or board. However, the performance of the decoupling solution is a function of capacitor selection and its placement. In this paper, an automatic capacitor placement optimization method has been proposed. This method relies on a genetic algorithm to provide a stochastic search of the design space, while employing an efficient core PDN simulator based on the multi-layer finite difference method (M-FDM). The technique has been employed to show optimized placements for split planes as well as for a realistic multi-layer server board.

Original languageEnglish (US)
Title of host publicationProceedings of the 45th Design Automation Conference, DAC
Number of pages6
StatePublished - 2008
Event45th Design Automation Conference, DAC - Anaheim, CA, United States
Duration: Jun 8 2008Jun 13 2008

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X


Other45th Design Automation Conference, DAC
Country/TerritoryUnited States
CityAnaheim, CA

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering


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