Band diagram for low-k/Cu interconnects: The starting point for understanding back-end-of-line (BEOL) electrical reliability

Keyphrases

• Band Diagram 100%
• Electrical Reliability 100%
• Defect States 75%
• Capping Layer 75%
• Interlayer Dielectric 75%
• Electron Paramagnetic Resonance 50%
• Semiconductors 50%
• Dielectric 50%
• Semiconductor Devices 50%
• Magnetic Resonance Measurements 50%
• Electrically Detected Magnetic Resonance 50%
• Low-k Dielectric 50%
• Band Alignment 50%
• X-ray Photoelectron Spectroscopy 25%
• Schottky Barrier 25%
• Metal Interfaces 25%
• Reliability Issues 25%
• Electronic Transport 25%
• Spectroscopic Measurement 25%
• Fermi Level 25%
• Electron Transport 25%
• Silicon Dangling Bond 25%
• Conduction Band 25%
• Dangling Bond Defect 25%
• Valence Band 25%
• Layer Interface 25%
• Energy Levels 25%
• Chemical Energy 25%
• Reflection Electron Energy Loss Spectroscopy (REELS) 25%
• Photoemission 25%
• Common Interface 25%
• Metal Contact 25%
• Trap States 25%
• State Diagram 25%
• Silicon Oxycarbide (SiOC) 25%
• Non-porous 25%
• Valence Band Offset 25%
• Interfacial Barrier 25%
• TiAlN 25%
• Interconnected Structure 25%
• Conduction Band Offset 25%

Material Science

• Dielectric Material 100%
• Semiconductor Device 25%
• Silicon 12%
• Electron Energy Loss Spectrometry 12%
• X-Ray Photoelectron Spectroscopy 12%
• Schottky Barrier 12%
• Metal Interface 12%
• Electron Transfer 12%
• Conductor 12%
• Band Offset 12%