TY - GEN
T1 - Behavioral Modeling of Steady-State Oscillators with Buffers Using Neural Networks
AU - Yu, Huan
AU - Chalamalasetty, Hemanth
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/11/13
Y1 - 2018/11/13
N2 - This paper describes a method to model the nonlinear time-domain steady-state behavior of oscillators with output buffers using neural networks. In the proposed model, an augmented neural network (AugNN) with a periodic unit is used to capture the periodicity of the oscillatory output waveform, where the nonlinear dynamic behavior of the output buffer is taken into account using recurrent neural networks (RNN). The model is trained using the data obtained from the simulation of transistor-level circuit models. The proposed model is compatible with Verilog-A. An example applied to a buffer-included ring oscillator demonstrates that the proposed modeling method offers good accuracy and significant simulation speed-up to facilitate time-domain analysis without compromising intellectual property (IP).
AB - This paper describes a method to model the nonlinear time-domain steady-state behavior of oscillators with output buffers using neural networks. In the proposed model, an augmented neural network (AugNN) with a periodic unit is used to capture the periodicity of the oscillatory output waveform, where the nonlinear dynamic behavior of the output buffer is taken into account using recurrent neural networks (RNN). The model is trained using the data obtained from the simulation of transistor-level circuit models. The proposed model is compatible with Verilog-A. An example applied to a buffer-included ring oscillator demonstrates that the proposed modeling method offers good accuracy and significant simulation speed-up to facilitate time-domain analysis without compromising intellectual property (IP).
UR - http://www.scopus.com/inward/record.url?scp=85058992382&partnerID=8YFLogxK
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U2 - 10.1109/EPEPS.2018.8534238
DO - 10.1109/EPEPS.2018.8534238
M3 - Conference contribution
AN - SCOPUS:85058992382
T3 - EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
SP - 307
EP - 309
BT - EPEPS 2018 - IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 27th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2018
Y2 - 14 October 2018 through 17 October 2018
ER -