Black-box optimization of 3D integrated systems using machine learning

Hakki M. Torun; Madhavan Swaminathan

doi:10.1109/EPEPS.2017.8329698

Black-box optimization of 3D integrated systems using machine learning

Hakki M. Torun
, Madhavan Swaminathan

Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Scopus citations

Abstract

Increasing complexity of electronics originates new challenges to system optimization. This work proposes a new black box optimization algorithm based on machine learning to address these challenges and analyzes its performance for clock skew minimization of 3D integrated systems.

Original language	English (US)
Title of host publication	2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1-3
Number of pages	3
ISBN (Electronic)	9781467364836
DOIs	https://doi.org/10.1109/EPEPS.2017.8329698
State	Published - Jul 2 2017
Event	26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 - San Jose, United States Duration: Oct 15 2017 → Oct 18 2017

Publication series

Name	2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Volume	2018-January

Conference

Conference	26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017
Country/Territory	United States
City	San Jose
Period	10/15/17 → 10/18/17

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Computer Networks and Communications
Electrical and Electronic Engineering

Access to Document

10.1109/EPEPS.2017.8329698

Cite this

Torun, H. M., & Swaminathan, M. (2017). Black-box optimization of 3D integrated systems using machine learning. In 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 (pp. 1-3). (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; Vol. 2018-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEPS.2017.8329698

Torun, Hakki M. ; Swaminathan, Madhavan. / Black-box optimization of 3D integrated systems using machine learning. 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 1-3 (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017).

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abstract = "Increasing complexity of electronics originates new challenges to system optimization. This work proposes a new black box optimization algorithm based on machine learning to address these challenges and analyzes its performance for clock skew minimization of 3D integrated systems.",

author = "Torun, \{Hakki M.\} and Madhavan Swaminathan",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017 ; Conference date: 15-10-2017 Through 18-10-2017",

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doi = "10.1109/EPEPS.2017.8329698",

language = "English (US)",

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Torun, HM & Swaminathan, M 2017, Black-box optimization of 3D integrated systems using machine learning. in 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017, vol. 2018-January, Institute of Electrical and Electronics Engineers Inc., pp. 1-3, 26th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017, San Jose, United States, 10/15/17. https://doi.org/10.1109/EPEPS.2017.8329698

Black-box optimization of 3D integrated systems using machine learning. / Torun, Hakki M.; Swaminathan, Madhavan.
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-3 (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; Vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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Torun HM, Swaminathan M. Black-box optimization of 3D integrated systems using machine learning. In 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 1-3. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017). doi: 10.1109/EPEPS.2017.8329698

Black-box optimization of 3D integrated systems using machine learning

Abstract

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Conference

All Science Journal Classification (ASJC) codes

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