Bottom Side Cooling for Glass Interposer with Chip Embedding using Double-sided Release Process for 6G Wireless Applications

Joon Woo Kim, Xingchen Li, Xiaofan Jia, Kyoung Sik Moon, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution


This paper presents a die-embedded glass interposer process using a new double-sided release method. This new method is introduced for CTE balancing and minimum warpage process for 6G wireless applications. In the glass interposer, through cavities are prepared in the glass substrate. Thermal test chip (TTC) is embedded into the through cavity and connected via redistribution layers (RDL) in the topside. A copper heat spreader is attached to the exposed TTC backside using thermal-interface material (TIM) for thermal management. The double-sided release method using two different carriers during the heat spreader attachment is the key to balancing the CTE and minimum warpage. The embedded TTC power density is tested to see the cooling capacity ranging up to 1W/mm2 with various heat transfer coefficients ranging between 28.8261.3 W/m2K. This work provides a solution for CTE mismatch during die embedding glass interposer process and provide minimum warpage.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages5
ISBN (Electronic)9798350334982
StatePublished - 2023
Event73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States
Duration: May 30 2023Jun 2 2023

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Country/TerritoryUnited States

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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