TY - JOUR
T1 - Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications
AU - Lin, Tong Hong
AU - Kanno, Kimiyuki
AU - Watanabe, Atom O.
AU - Raj, Pulugurtha Markondeya
AU - Tummala, Rao R.
AU - Swaminathan, Madhavan
AU - Tentzeris, Manos M.
N1 - Publisher Copyright:
© 2002-2011 IEEE.
PY - 2020/11
Y1 - 2020/11
N2 - A broadband and miniaturized planar Yagi antenna-in-package (AiP) design for the fifth-generation (5G) wireless communication is proposed. The monopole taper radiator is adopted for the proposed Yagi antenna design to miniaturize the size, extend the bandwidth, and simplify the feeding network. The proposed AiP design is broadband enough to cover all three 5G New Radio bands simultaneously. The high-precision high-resolution multilayered glass packaging fabrication process with a new low-loss polymer material coating is adopted to realize the circuit. The operation band is from 24.25 to 40 GHz and the fractional bandwidth is 49%. The overall size for an antenna element is 3.05 mm × 5.56 mm, which is equal to 0.25 λ -0 × 0.45 λ 0. The measured S 11} is smaller than -10 dB within the entire band and the gain is larger than 4 dBi. A two-by-one array using the proposed element is also demonstrated with a gain higher than 6.2 dBi within the entire band. Compared with previous works, the proposed AiP design can cover all 5G bands with a competitive size. Thus, it is suitable to be applied to massive arrays and easily integrated into packages to achieve compact system-in-package applications while resolving numerous current 5G challenges, including millimeter-wave (mm-wave) path loss and transmission loss.
AB - A broadband and miniaturized planar Yagi antenna-in-package (AiP) design for the fifth-generation (5G) wireless communication is proposed. The monopole taper radiator is adopted for the proposed Yagi antenna design to miniaturize the size, extend the bandwidth, and simplify the feeding network. The proposed AiP design is broadband enough to cover all three 5G New Radio bands simultaneously. The high-precision high-resolution multilayered glass packaging fabrication process with a new low-loss polymer material coating is adopted to realize the circuit. The operation band is from 24.25 to 40 GHz and the fractional bandwidth is 49%. The overall size for an antenna element is 3.05 mm × 5.56 mm, which is equal to 0.25 λ -0 × 0.45 λ 0. The measured S 11} is smaller than -10 dB within the entire band and the gain is larger than 4 dBi. A two-by-one array using the proposed element is also demonstrated with a gain higher than 6.2 dBi within the entire band. Compared with previous works, the proposed AiP design can cover all 5G bands with a competitive size. Thus, it is suitable to be applied to massive arrays and easily integrated into packages to achieve compact system-in-package applications while resolving numerous current 5G challenges, including millimeter-wave (mm-wave) path loss and transmission loss.
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U2 - 10.1109/LAWP.2020.3018064
DO - 10.1109/LAWP.2020.3018064
M3 - Article
AN - SCOPUS:85097352309
SN - 1536-1225
VL - 19
SP - 1963
EP - 1967
JO - IEEE Antennas and Wireless Propagation Letters
JF - IEEE Antennas and Wireless Propagation Letters
IS - 11
M1 - 9171437
ER -