Bump and trench modifications to film-cooling holes at the vane endwall junction

N. Sundaram, K. A. Thole

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Scopus citations

Abstract

The endwall of a first stage vane experiences high heat transfer and low adiabatic effectiveness levels because of high turbine operating temperatures and formation of leading edge vortices. These vortices lift the coolant off the endwall and pull the hot mainstream gases towards it. The region of focus for this study is the vane-endwall junction region near the stagnation location where cooling is very difficult. Two different film-cooling hole modifications, namely trenches and bumps, were evaluated to improve the cooling in the leading edge region. This study uses a large-scale turbine vane cascade with a single row of axial film-cooling holes at the leading edge of the vane endwall. Individual hole trenches and row trenches were placed along the complete row of film-cooling holes. Two-dimensional semi-elliptically shaped bumps were also evaluated by placing the bumps upstream and downstream of the film-cooling row. Tests were carried out for different trench depths and bump heights under varying blowing ratios. The results indicated that a row trench placed along the row of film-cooling holes showed a greater enhancement in adiabatic effectiveness levels when compared to individual hole trenches and bumps. All geometries considered produced an overall improvement to adiabatic effectiveness levels.

Original languageEnglish (US)
Title of host publicationProceedings of the ASME Turbo Expo 2007 - Power for Land, Sea, and Air
Pages197-207
Number of pages11
DOIs
StatePublished - 2007
Event2007 ASME Turbo Expo - Montreal, Que., Canada
Duration: May 14 2007May 17 2007

Publication series

NameProceedings of the ASME Turbo Expo
Volume4 PART A

Other

Other2007 ASME Turbo Expo
Country/TerritoryCanada
CityMontreal, Que.
Period5/14/075/17/07

All Science Journal Classification (ASJC) codes

  • General Engineering

Fingerprint

Dive into the research topics of 'Bump and trench modifications to film-cooling holes at the vane endwall junction'. Together they form a unique fingerprint.

Cite this