TY - JOUR
T1 - Capturing via effects in simultaneous switching noise simulation
AU - Chun, Sungjun
AU - Choi, Jinseong
AU - Dalmia, Sidharth
AU - Kim, Woopoung
AU - Swaminathan, Madhavan
PY - 2001
Y1 - 2001
N2 - This paper presents a method for including via effects in modeling Simultaneous Switching Noise (SSN). Models for interconnections and multi-layered planes have been developed and combined using superposition based on skin depth approximation to capture the return current effect due to via transitions. Measurements on active board containing the drivers, transmission lines, vias and planes have been conducted. The modeling approach has been correlated with measurements, showing the validity of the method. The modeling method has been extended and applied to large size systems to model the power supply fluctuations due to via transitions.
AB - This paper presents a method for including via effects in modeling Simultaneous Switching Noise (SSN). Models for interconnections and multi-layered planes have been developed and combined using superposition based on skin depth approximation to capture the return current effect due to via transitions. Measurements on active board containing the drivers, transmission lines, vias and planes have been conducted. The modeling approach has been correlated with measurements, showing the validity of the method. The modeling method has been extended and applied to large size systems to model the power supply fluctuations due to via transitions.
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U2 - 10.1109/ISEMC.2001.950609
DO - 10.1109/ISEMC.2001.950609
M3 - Article
AN - SCOPUS:0035786813
SN - 0190-1494
VL - 2
SP - 1221
EP - 1226
JO - IEEE International Symposium on Electromagnetic Compatibility
JF - IEEE International Symposium on Electromagnetic Compatibility
ER -