Capturing via effects in simultaneous switching noise simulation

Sungjun Chun; Jinseong Choi; Sidharth Dalmia; Woopoung Kim; Madhavan Swaminathan

doi:10.1109/ISEMC.2001.950609

Capturing via effects in simultaneous switching noise simulation

Sungjun Chun
, Jinseong Choi
, Sidharth Dalmia
, Woopoung Kim
, Madhavan Swaminathan

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

14 Scopus citations

Abstract

This paper presents a method for including via effects in modeling Simultaneous Switching Noise (SSN). Models for interconnections and multi-layered planes have been developed and combined using superposition based on skin depth approximation to capture the return current effect due to via transitions. Measurements on active board containing the drivers, transmission lines, vias and planes have been conducted. The modeling approach has been correlated with measurements, showing the validity of the method. The modeling method has been extended and applied to large size systems to model the power supply fluctuations due to via transitions.

Original language	English (US)
Pages (from-to)	1221-1226
Number of pages	6
Journal	IEEE International Symposium on Electromagnetic Compatibility
Volume	2
DOIs	https://doi.org/10.1109/ISEMC.2001.950609
State	Published - 2001

All Science Journal Classification (ASJC) codes

Condensed Matter Physics
Electrical and Electronic Engineering

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10.1109/ISEMC.2001.950609

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abstract = "This paper presents a method for including via effects in modeling Simultaneous Switching Noise (SSN). Models for interconnections and multi-layered planes have been developed and combined using superposition based on skin depth approximation to capture the return current effect due to via transitions. Measurements on active board containing the drivers, transmission lines, vias and planes have been conducted. The modeling approach has been correlated with measurements, showing the validity of the method. The modeling method has been extended and applied to large size systems to model the power supply fluctuations due to via transitions.",

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doi = "10.1109/ISEMC.2001.950609",

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journal = "IEEE International Symposium on Electromagnetic Compatibility",

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AU - Chun, Sungjun

AU - Choi, Jinseong

AU - Dalmia, Sidharth

AU - Kim, Woopoung

AU - Swaminathan, Madhavan

PY - 2001

Y1 - 2001

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AB - This paper presents a method for including via effects in modeling Simultaneous Switching Noise (SSN). Models for interconnections and multi-layered planes have been developed and combined using superposition based on skin depth approximation to capture the return current effect due to via transitions. Measurements on active board containing the drivers, transmission lines, vias and planes have been conducted. The modeling approach has been correlated with measurements, showing the validity of the method. The modeling method has been extended and applied to large size systems to model the power supply fluctuations due to via transitions.

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UR - https://www.scopus.com/pages/publications/0035786813#tab=citedBy

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JO - IEEE International Symposium on Electromagnetic Compatibility

JF - IEEE International Symposium on Electromagnetic Compatibility

ER -

Capturing via effects in simultaneous switching noise simulation

Abstract

All Science Journal Classification (ASJC) codes

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