Abstract
Often times, a product engineer has a wide array of electronic packages that he can choose from for his application. The package that he finally chooses is a trade-off between the cost Vs performance of the various packages. This paper discusses the performance comparison between two types of packages namely the ceramic quad flat pack (CQFP) and ceramic ball grid array (CBGA). Typically packages are compared in terms of the lead resistances, inductances and capacitances which rarely provide details on the effect of these parameters at the systems level. This paper looks at the package comparison with considerable emphasis placed on the system by including the details of the onchip metallization and second level (PCB) package parasitics.
| Original language | English (US) |
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| Pages | 10-13 |
| Number of pages | 4 |
| State | Published - 1994 |
| Event | Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging - Monterey, CA, USA Duration: Nov 2 1994 → Nov 4 1994 |
Conference
| Conference | Proceedings of the 3rd Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | Monterey, CA, USA |
| Period | 11/2/94 → 11/4/94 |
All Science Journal Classification (ASJC) codes
- General Engineering