TY - GEN
T1 - CCC
T2 - Euromicro Symposium on Digital System Design, DSD 2003
AU - Li, Lin
AU - Vijaykrishnan, N.
AU - Kandemir, M.
AU - Irwin, M. J.
AU - Kadayif, I.
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - With shrinking feature size of silicon fabrication technology, architects are putting more and more logic into a single die. While one might opt to use these transistors for building complex single processor based architectures, recent trends indicate a shift towards on-chip multiprocessor systems since they are simpler to implement and can provide better performance. An important problem in on-chip multiprocessors is energy consumption. In particular, on-chip cache structures can be major energy consumers. In this work, we study energy behavior of different cache architectures, and propose a new architecture, where processors share a single, banked cache using crossbar interconnects. Our detailed cycle-accurate simulations show that this cache architecture brings energy benefits ranging from 9[%] to 26[%] (over an architecture where each processor has a private cache).
AB - With shrinking feature size of silicon fabrication technology, architects are putting more and more logic into a single die. While one might opt to use these transistors for building complex single processor based architectures, recent trends indicate a shift towards on-chip multiprocessor systems since they are simpler to implement and can provide better performance. An important problem in on-chip multiprocessors is energy consumption. In particular, on-chip cache structures can be major energy consumers. In this work, we study energy behavior of different cache architectures, and propose a new architecture, where processors share a single, banked cache using crossbar interconnects. Our detailed cycle-accurate simulations show that this cache architecture brings energy benefits ranging from 9[%] to 26[%] (over an architecture where each processor has a private cache).
UR - http://www.scopus.com/inward/record.url?scp=35348895370&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=35348895370&partnerID=8YFLogxK
U2 - 10.1109/DSD.2003.1231898
DO - 10.1109/DSD.2003.1231898
M3 - Conference contribution
AN - SCOPUS:35348895370
T3 - Proceedings - Euromicro Symposium on Digital System Design, DSD 2003
SP - 41
EP - 48
BT - Proceedings - Euromicro Symposium on Digital System Design, DSD 2003
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 1 September 2003 through 6 September 2003
ER -