Abstract
In this experiment the effect of Hf content on the properties of Hf(Si,O) MOS gate dielectrics is investigated. Change of Hf content in the film is accomplished by varying Hf:Si mixing ratio in liquid precursor used for mist deposition of Hf(Si,O) films. Dielectric constant k increases as the Si content in the film decreases. Advantages of using nonstoichiometric HfSiO x featuring 3:1 Hf:Si ratio in terms of reduced EOT were observed. On the other hand, ternary compositions of HfSiO x did show inferior resistance to charge trapping as compared to HfO 2.
Original language | English (US) |
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Pages | 404-410 |
Number of pages | 7 |
State | Published - Dec 1 2005 |
Event | 207th ECS Meeting - Quebec, Canada Duration: May 16 2005 → May 20 2005 |
Other
Other | 207th ECS Meeting |
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Country/Territory | Canada |
City | Quebec |
Period | 5/16/05 → 5/20/05 |
All Science Journal Classification (ASJC) codes
- General Engineering