TY - JOUR
T1 - Characterization of a small peripheral array package
AU - Hao, Jie
AU - Richter, Andre
AU - Laskar, Joy
AU - Swaminathan, Madhavan
AU - Mosley, J.
N1 - Funding Information:
Manuscript received October 11, 1995; revised December 12, 1995. This work was supported by the National Science Foundation Packaging Research Center under Contract EEC-9 402 723, Archistrat Technologies, Cascade Mi- crotech, and Hewlett-Packard. This paper was presented at the 4th IEEE Topical Meeting on Electrical Performance of Electronic Packaging, Portland, OR, October 2 4 , 1995. J. Hao, A. Richter, and J. Laskar are with the School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GE 30332 USA. M. Swaminathan is with the Packaging Research Center, Georgia Institute of Technology, Atlanta, GE 30332 USA. J. Mosley is with Archistrat Technology, Division of the Panda Project, Boca Raton, FL 33487 USA. Publisher Item Identifier S 1070-9894(96)05005-0.
PY - 1996/8
Y1 - 1996/8
N2 - This paper provides details on a very small peripheral array (VSPA) cavity package with high I/O's that is surface mountable on a printed circuit board (PCB). The package consists of 320 leads and measures 27 mm on a side. This paper discusses the package attributes, comparison to equivalent packages, and characterization of the package parasitics up to 3.5 GHz.
AB - This paper provides details on a very small peripheral array (VSPA) cavity package with high I/O's that is surface mountable on a printed circuit board (PCB). The package consists of 320 leads and measures 27 mm on a side. This paper discusses the package attributes, comparison to equivalent packages, and characterization of the package parasitics up to 3.5 GHz.
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U2 - 10.1109/96.533889
DO - 10.1109/96.533889
M3 - Article
AN - SCOPUS:0030214857
SN - 1070-9894
VL - 19
SP - 512
EP - 517
JO - IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
JF - IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
IS - 3
ER -