TY - JOUR
T1 - Characterization of co-planar silicon transmission lines with and without slow-wave effect
AU - Kim, Woopoung
AU - Swaminathan, Madhavan
PY - 2007/8
Y1 - 2007/8
N2 - Co-planar lines on silicon substrates with and without slow-wave effect are characterized using time-domain reflectometry (TDR) and vector network analyzer (VNA) measurements, and simulated using a proposed nonphysical resistance-inductance-conductance-capacitance (RLGC) model. The silicon co-planar lines are characterized based on comparison to package transmission lines. Co-planar silicon lines without slow-wave mode are modeled in the same way as package transmission lines, but co-planar lines with slow-wave mode are modeled in a different way from package transmission lines. Hence, a nonphysical RLGC model including slow-wave mode is proposed along with the extraction method from VNA measurements. Simulation results correlate well with time- and frequency-domain measurements for the co-planar silicon lines.
AB - Co-planar lines on silicon substrates with and without slow-wave effect are characterized using time-domain reflectometry (TDR) and vector network analyzer (VNA) measurements, and simulated using a proposed nonphysical resistance-inductance-conductance-capacitance (RLGC) model. The silicon co-planar lines are characterized based on comparison to package transmission lines. Co-planar silicon lines without slow-wave mode are modeled in the same way as package transmission lines, but co-planar lines with slow-wave mode are modeled in a different way from package transmission lines. Hence, a nonphysical RLGC model including slow-wave mode is proposed along with the extraction method from VNA measurements. Simulation results correlate well with time- and frequency-domain measurements for the co-planar silicon lines.
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U2 - 10.1109/TADVP.2007.898623
DO - 10.1109/TADVP.2007.898623
M3 - Article
AN - SCOPUS:34548186916
SN - 1521-3323
VL - 30
SP - 526
EP - 532
JO - IEEE Transactions on Advanced Packaging
JF - IEEE Transactions on Advanced Packaging
IS - 3
ER -