Abstract
Co-planar lines on silicon substrates with and without slow-wave mode have been characterized and simulated using non-physical RLGC models extracted from VNA measurements. The difference between silicon and package transmission lines has been explained showing that the slow-wave mode cannot be represented only by the characteristic impedance and propagation constant.
Original language | English (US) |
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Pages | 21-24 |
Number of pages | 4 |
State | Published - 2004 |
Event | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004 |
Conference
Conference | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
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Country/Territory | United States |
City | Portland, OR |
Period | 10/25/04 → 10/27/04 |
All Science Journal Classification (ASJC) codes
- General Engineering