Abstract
Co-planar lines on silicon substrates with and without slow-wave mode have been characterized and simulated using non-physical RLGC models extracted from VNA measurements. The difference between silicon and package transmission lines has been explained showing that the slow-wave mode cannot be represented only by the characteristic impedance and propagation constant.
| Original language | English (US) |
|---|---|
| Pages | 21-24 |
| Number of pages | 4 |
| State | Published - 2004 |
| Event | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging - Portland, OR, United States Duration: Oct 25 2004 → Oct 27 2004 |
Conference
| Conference | IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Portland, OR |
| Period | 10/25/04 → 10/27/04 |
All Science Journal Classification (ASJC) codes
- General Engineering