Characterization of Dielectric Materials Beyond Room Temperature Using the Lab-Developed Temperature Split Cavity (TSC) Method

The evolution of 5G telecommunications and the development of future 6G networks demand precise characterization of dielectric materials at high frequencies to enhance filter design and advanced electronic packaging. This paper evaluates essential dielectric parameters like relative permittivity, loss tangent, and temperature coefficient within the 2-20 GHz range. Traditional measurement techniques, such as Split Post and Split Cavity methods, effectively assess small substrates like polymers, glasses, and ceramics at room temperature. To extend characterization beyond ambient conditions, this paper introduces the Temperature Split Cavity (TSC) and Temperature Coefficient of Capacitance (TCC) techniques, enabling measurements from -50° C to 100° C with a scale of 50° C and -150° C to 200° C, respectively. The TSC method revealed a linear relationship between relative permittivity and temperature, allowing accurate calculation of temperature coefficients. Validation against capacitor measurements at 1 MHz confirmed the consistency and reliability of TSC results. Additionally, the TSC technique successfully characterizes substrate materials with both ionic and covalent bonding. These findings demonstrate that TSC is a robust and reliable method for determining the temperaturedependent dielectric properties of materials essential for highfrequency telecommunications applications beyond room temperature.