TY - JOUR
T1 - Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications
AU - Dwarakanath, Shreya
AU - Bhaskar, Pragna
AU - Kanno, Kimiyuki
AU - Nimbalkar, Pratik C.
AU - Kathaperumal, Mohanalingam
AU - Raj Pulugurtha, Markondeya
AU - Swaminathan, Madhavan
AU - Tummala, Rao R.
N1 - Publisher Copyright:
© 2011-2012 IEEE.
PY - 2025
Y1 - 2025
N2 - This article reports the investigation of electrical, physical, mechanical, and chemical performance of emerging polymer dielectrics for next-generation high-performance computing (HPC) needs for ultrahigh bandwidth. The impact of critical dielectric properties such as ultralow Dk (<3.0), ultra-thin (< 5 μ m), and low moisture absorption are characterized. Planarization requirements for impedance control in sub-2μm line and spaces are investigated for liquid and dry-film dielectrics. The role of coefficient of thermal expansion (CTE) in dielectric stresses and warpage with low CTE substrates is also studied. Electrical instabilities resulting from moisture retention are also assessed. The characterization results from advanced design rules provide critical guidelines on dielectric materials design for advanced packaging architectures.
AB - This article reports the investigation of electrical, physical, mechanical, and chemical performance of emerging polymer dielectrics for next-generation high-performance computing (HPC) needs for ultrahigh bandwidth. The impact of critical dielectric properties such as ultralow Dk (<3.0), ultra-thin (< 5 μ m), and low moisture absorption are characterized. Planarization requirements for impedance control in sub-2μm line and spaces are investigated for liquid and dry-film dielectrics. The role of coefficient of thermal expansion (CTE) in dielectric stresses and warpage with low CTE substrates is also studied. Electrical instabilities resulting from moisture retention are also assessed. The characterization results from advanced design rules provide critical guidelines on dielectric materials design for advanced packaging architectures.
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U2 - 10.1109/TCPMT.2024.3480090
DO - 10.1109/TCPMT.2024.3480090
M3 - Article
AN - SCOPUS:85207321539
SN - 2156-3950
VL - 15
SP - 131
EP - 139
JO - IEEE Transactions on Components, Packaging and Manufacturing Technology
JF - IEEE Transactions on Components, Packaging and Manufacturing Technology
IS - 1
ER -