Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz

Seunghyun Hwang; Sunghwan Min; Madhavan Swaminathan; Venkatesan Venkatakrishnan; Hunter Chan; Fuhan Liu; Venky Sundaram; Scott Kennedy; Dirk Baars; Benjamin Lacroix; Yuan Li; John Papapolymerou

doi:10.1109/TADVP.2009.2023413

Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz

Seunghyun Hwang, Sunghwan Min, Madhavan Swaminathan, Venkatesan Venkatakrishnan, Hunter Chan, Fuhan Liu, Venky Sundaram, Scott Kennedy, Dirk Baars, Benjamin Lacroix, Yuan Li, John Papapolymerou

Electrical Engineering

Research output: Contribution to journal › Article › peer-review

12 Scopus citations

Abstract

This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.933.48) and low loss tangent (0.00370.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.

Original language	English (US)
Article number	5208240
Pages (from-to)	180-188
Number of pages	9
Journal	IEEE Transactions on Advanced Packaging
Volume	33
Issue number	1
DOIs	https://doi.org/10.1109/TADVP.2009.2023413
State	Published - Feb 2010

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1109/TADVP.2009.2023413

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Hwang, S., Min, S., Swaminathan, M., Venkatakrishnan, V., Chan, H., Liu, F., Sundaram, V., Kennedy, S., Baars, D., Lacroix, B., Li, Y., & Papapolymerou, J. (2010). Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz. IEEE Transactions on Advanced Packaging, 33(1), 180-188. Article 5208240. https://doi.org/10.1109/TADVP.2009.2023413

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title = "Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz",

abstract = "This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.933.48) and low loss tangent (0.00370.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.",

author = "Seunghyun Hwang and Sunghwan Min and Madhavan Swaminathan and Venkatesan Venkatakrishnan and Hunter Chan and Fuhan Liu and Venky Sundaram and Scott Kennedy and Dirk Baars and Benjamin Lacroix and Yuan Li and John Papapolymerou",

note = "Funding Information: Dr. Papapolymerou is the Chair for Commission D of the U.S. National Committee of URSI. He is Associate Editor for the IEEE MICROWAVE AND WIRELESS COMPONENT LETTERS and the IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION. During 2004, he was the Chair of the IEEE MTT/AP Atlanta Chapter. He was the recipient of the 2009 IEEE MTT-S Outstanding Young Engineer Award, the 2004 Army Research Office (ARO) Young Investigator Award, the 2002 National Science Foundation (NSF) CAREER award, the best paper award at the 3rd IEEE International Conference on Microwave and Millimeter-Wave Technology (ICMMT2002), Beijing, China and the 1997 Outstanding Graduate Student Instructional Assistant Award presented by the American Society for Engineering Education (ASEE), The University of Michigan Chapter. His students have also been recipients of several awards including the Best Student Paper Award presented at the 2004 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, the 2007 IEEE MTT-S Graduate Fellowship, and the 2007/2008 and 2008/2009 IEEE MTT-S Undergraduate Scholarship/Fellowship.",

year = "2010",

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doi = "10.1109/TADVP.2009.2023413",

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Hwang, S, Min, S, Swaminathan, M, Venkatakrishnan, V, Chan, H, Liu, F, Sundaram, V, Kennedy, S, Baars, D, Lacroix, B, Li, Y & Papapolymerou, J 2010, 'Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz', IEEE Transactions on Advanced Packaging, vol. 33, no. 1, 5208240, pp. 180-188. https://doi.org/10.1109/TADVP.2009.2023413

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AU - Min, Sunghwan

AU - Swaminathan, Madhavan

AU - Venkatakrishnan, Venkatesan

AU - Chan, Hunter

AU - Liu, Fuhan

AU - Sundaram, Venky

AU - Kennedy, Scott

AU - Baars, Dirk

AU - Lacroix, Benjamin

AU - Li, Yuan

AU - Papapolymerou, John

N1 - Funding Information: Dr. Papapolymerou is the Chair for Commission D of the U.S. National Committee of URSI. He is Associate Editor for the IEEE MICROWAVE AND WIRELESS COMPONENT LETTERS and the IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION. During 2004, he was the Chair of the IEEE MTT/AP Atlanta Chapter. He was the recipient of the 2009 IEEE MTT-S Outstanding Young Engineer Award, the 2004 Army Research Office (ARO) Young Investigator Award, the 2002 National Science Foundation (NSF) CAREER award, the best paper award at the 3rd IEEE International Conference on Microwave and Millimeter-Wave Technology (ICMMT2002), Beijing, China and the 1997 Outstanding Graduate Student Instructional Assistant Award presented by the American Society for Engineering Education (ASEE), The University of Michigan Chapter. His students have also been recipients of several awards including the Best Student Paper Award presented at the 2004 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, the 2007 IEEE MTT-S Graduate Fellowship, and the 2007/2008 and 2008/2009 IEEE MTT-S Undergraduate Scholarship/Fellowship.

PY - 2010/2

Y1 - 2010/2

N2 - This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.933.48) and low loss tangent (0.00370.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.

AB - This paper presents, for the first time, characterization results of next generation dielectric core and build up material called RXP, which has low dielectric constant (2.933.48) and low loss tangent (0.00370.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.

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ER -

Characterization of next generation thin low-K and low-loss organic dielectrics from 1 to 110 GHz

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