Characterization of the electrical performance of different signal via geometries

Sedig S. Agili, Stephen B. Smith, Vittal Balasubramanian

Research output: Contribution to journalArticlepeer-review

2 Scopus citations


Several signal via geometries are analyzed for across and through transmission by varying the drill-hole diameter, ratio of the pad and antipad diameters to drill-hole diameter, and number of ground planes. Time- and frequency-domain results showing impedance-, insertion-, and return-loss trends, which are useful for designing via geometries for high-speed transmission, are obtained.

Original languageEnglish (US)
Pages (from-to)315-320
Number of pages6
JournalMicrowave and Optical Technology Letters
Issue number2
StatePublished - Feb 2006

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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