Abstract
Several signal via geometries are analyzed for across and through transmission by varying the drill-hole diameter, ratio of the pad and antipad diameters to drill-hole diameter, and number of ground planes. Time- and frequency-domain results showing impedance-, insertion-, and return-loss trends, which are useful for designing via geometries for high-speed transmission, are obtained.
Original language | English (US) |
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Pages (from-to) | 315-320 |
Number of pages | 6 |
Journal | Microwave and Optical Technology Letters |
Volume | 48 |
Issue number | 2 |
DOIs | |
State | Published - Feb 2006 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Electrical and Electronic Engineering