Characterization of thin film organic materials at high frequency

Sidharth Dalmia; Joseph M. Hobbs; Venky Sundaram; Madhavan Swaminathan; George E. White; Rao R. Tummala; S. Ogitani

Characterization of thin film organic materials at high frequency

Sidharth Dalmia, Joseph M. Hobbs, Venky Sundaram, Madhavan Swaminathan, George E. White, Rao R. Tummala, S. Ogitani

Electrical Engineering

Research output: Contribution to conference › Paper › peer-review

1 Scopus citations

Abstract

By considering the potential variation of process parameters such as line width and dielectric thickness, several hybrid coplanar waveguide microstrip (CPWM) well matched lines were designed, fabricated and tested up to 6 GHz on a low loss thin film organic high density interconnect (HDI) substrate. The multiple CPWM lines were then used to characterize the thin film dielectric up to 6 GHz.

Original language	English (US)
Pages	133-136
Number of pages	4
State	Published - 2001
Event	IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States Duration: Oct 29 2001 → Oct 31 2001

Conference

Conference	IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging
Country/Territory	United States
City	Cambridge, MA
Period	10/29/01 → 10/31/01

All Science Journal Classification (ASJC) codes

General Engineering

Cite this

@conference{041f15dcfeb04bfd93d16a3be603cc39,

title = "Characterization of thin film organic materials at high frequency",

abstract = "By considering the potential variation of process parameters such as line width and dielectric thickness, several hybrid coplanar waveguide microstrip (CPWM) well matched lines were designed, fabricated and tested up to 6 GHz on a low loss thin film organic high density interconnect (HDI) substrate. The multiple CPWM lines were then used to characterize the thin film dielectric up to 6 GHz.",

author = "Sidharth Dalmia and Hobbs, {Joseph M.} and Venky Sundaram and Madhavan Swaminathan and White, {George E.} and Tummala, {Rao R.} and S. Ogitani",

year = "2001",

language = "English (US)",

pages = "133--136",

note = "IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging ; Conference date: 29-10-2001 Through 31-10-2001",

}

TY - CONF

T1 - Characterization of thin film organic materials at high frequency

AU - Dalmia, Sidharth

AU - Hobbs, Joseph M.

AU - Sundaram, Venky

AU - Swaminathan, Madhavan

AU - White, George E.

AU - Tummala, Rao R.

AU - Ogitani, S.

PY - 2001

Y1 - 2001

N2 - By considering the potential variation of process parameters such as line width and dielectric thickness, several hybrid coplanar waveguide microstrip (CPWM) well matched lines were designed, fabricated and tested up to 6 GHz on a low loss thin film organic high density interconnect (HDI) substrate. The multiple CPWM lines were then used to characterize the thin film dielectric up to 6 GHz.

AB - By considering the potential variation of process parameters such as line width and dielectric thickness, several hybrid coplanar waveguide microstrip (CPWM) well matched lines were designed, fabricated and tested up to 6 GHz on a low loss thin film organic high density interconnect (HDI) substrate. The multiple CPWM lines were then used to characterize the thin film dielectric up to 6 GHz.

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UR - http://www.scopus.com/inward/citedby.url?scp=0035704299&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:0035704299

SP - 133

EP - 136

T2 - IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging

Y2 - 29 October 2001 through 31 October 2001

ER -

Characterization of thin film organic materials at high frequency

Abstract

Conference

All Science Journal Classification (ASJC) codes

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