Abstract
By considering the potential variation of process parameters such as line width and dielectric thickness, several hybrid coplanar waveguide microstrip (CPWM) well matched lines were designed, fabricated and tested up to 6 GHz on a low loss thin film organic high density interconnect (HDI) substrate. The multiple CPWM lines were then used to characterize the thin film dielectric up to 6 GHz.
| Original language | English (US) |
|---|---|
| Pages | 133-136 |
| Number of pages | 4 |
| State | Published - 2001 |
| Event | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging - Cambridge, MA, United States Duration: Oct 29 2001 → Oct 31 2001 |
Conference
| Conference | IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging |
|---|---|
| Country/Territory | United States |
| City | Cambridge, MA |
| Period | 10/29/01 → 10/31/01 |
All Science Journal Classification (ASJC) codes
- General Engineering
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