Chip-embedded Glass Interposer for 5G Applications

Xingchen Li, Xiaofan Jia, Kyoung Sik Moon, Joon Woo Kim, Aadit Pandey, Anthony Chiu, Andrew Kenerson, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the implementation of a chip-embedded glass interposer targeting 5G applications. Two approaches for low-loss interconnect design on the interposer are demonstrated for the first time on 5G bands by modeling, fabrication, and measurements. Enabled by the interconnects, the fabricated chip-embedded interposer performs low loss and wideband matching over 40 GHz. The excellent performance proves the chip-embedded glass interposer a promising package solution for 5G front-end modules.

Original languageEnglish (US)
Title of host publication2023 IEEE Radio and Wireless Symposium, RWS 2023
PublisherIEEE Computer Society
Pages129-131
Number of pages3
ISBN (Electronic)9781665493444
DOIs
StatePublished - 2023
Event2023 IEEE Radio and Wireless Symposium, RWS 2023 - Las Vegas, United States
Duration: Jan 22 2023Jan 25 2023

Publication series

NameIEEE Radio and Wireless Symposium, RWS
Volume2023-January
ISSN (Print)2164-2958
ISSN (Electronic)2164-2974

Conference

Conference2023 IEEE Radio and Wireless Symposium, RWS 2023
Country/TerritoryUnited States
CityLas Vegas
Period1/22/231/25/23

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering
  • Communication

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