TY - GEN
T1 - Chip-embedded Glass Interposer for 5G Applications
AU - Li, Xingchen
AU - Jia, Xiaofan
AU - Moon, Kyoung Sik
AU - Kim, Joon Woo
AU - Pandey, Aadit
AU - Chiu, Anthony
AU - Kenerson, Andrew
AU - Swaminathan, Madhavan
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper presents the implementation of a chip-embedded glass interposer targeting 5G applications. Two approaches for low-loss interconnect design on the interposer are demonstrated for the first time on 5G bands by modeling, fabrication, and measurements. Enabled by the interconnects, the fabricated chip-embedded interposer performs low loss and wideband matching over 40 GHz. The excellent performance proves the chip-embedded glass interposer a promising package solution for 5G front-end modules.
AB - This paper presents the implementation of a chip-embedded glass interposer targeting 5G applications. Two approaches for low-loss interconnect design on the interposer are demonstrated for the first time on 5G bands by modeling, fabrication, and measurements. Enabled by the interconnects, the fabricated chip-embedded interposer performs low loss and wideband matching over 40 GHz. The excellent performance proves the chip-embedded glass interposer a promising package solution for 5G front-end modules.
UR - http://www.scopus.com/inward/record.url?scp=85149292520&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85149292520&partnerID=8YFLogxK
U2 - 10.1109/RWS55624.2023.10046338
DO - 10.1109/RWS55624.2023.10046338
M3 - Conference contribution
AN - SCOPUS:85149292520
T3 - IEEE Radio and Wireless Symposium, RWS
SP - 129
EP - 131
BT - 2023 IEEE Radio and Wireless Symposium, RWS 2023
PB - IEEE Computer Society
T2 - 2023 IEEE Radio and Wireless Symposium, RWS 2023
Y2 - 22 January 2023 through 25 January 2023
ER -