TY - GEN
T1 - Chip-package co-simulation with multiscale structures
AU - Ha, Myunghyun
AU - Srinivasan, Krishna
AU - Swaminathan, Madhavan
PY - 2008
Y1 - 2008
N2 - Chip-package co-simulation is required to predict the interaction between the chip and package at the system level. The FDTD method can be used to analyze these structures but is limited by the Courant condition. In this paper, an alternate method is suggested by combining Laguerre Polynomials with the FDTD method. Since, the solution is implicit, the Courant condition is no longer an issue and therefore the method provides unconditional stability. In addition, the time domain response can be computed similar to the FDTD scheme. The formulation allows the conversion of an electromagnetic problem to a circuit representation with resistors, voltage and current sources. Such a representation is useful since a DC solution can be used to obtain the transient response. To obtain the low frequency response using an FDTD based method, computing the time domain response over long time duration is required. Due to the behavior of the Laguerre Polynomials, this can be difficult. In this paper, computing the time domain response over several micro-seconds is discussed using Laguerre Polynomials combined with the FDTD scheme. This method now can be applied to compute the frequency response from DC to very high frequencies for multi-scale structures arising in chip-package co-simulation.
AB - Chip-package co-simulation is required to predict the interaction between the chip and package at the system level. The FDTD method can be used to analyze these structures but is limited by the Courant condition. In this paper, an alternate method is suggested by combining Laguerre Polynomials with the FDTD method. Since, the solution is implicit, the Courant condition is no longer an issue and therefore the method provides unconditional stability. In addition, the time domain response can be computed similar to the FDTD scheme. The formulation allows the conversion of an electromagnetic problem to a circuit representation with resistors, voltage and current sources. Such a representation is useful since a DC solution can be used to obtain the transient response. To obtain the low frequency response using an FDTD based method, computing the time domain response over long time duration is required. Due to the behavior of the Laguerre Polynomials, this can be difficult. In this paper, computing the time domain response over several micro-seconds is discussed using Laguerre Polynomials combined with the FDTD scheme. This method now can be applied to compute the frequency response from DC to very high frequencies for multi-scale structures arising in chip-package co-simulation.
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U2 - 10.1109/EPEP.2008.4675950
DO - 10.1109/EPEP.2008.4675950
M3 - Conference contribution
AN - SCOPUS:58049116388
SN - 9781424428731
T3 - Electrical Performance of Electronic Packaging, EPEP
SP - 339
EP - 342
BT - Electrical Performance of Electronic Packaging, EPEP 2008
T2 - 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Y2 - 27 October 2008 through 29 October 2008
ER -