Chip-package co-simulation with multiscale structures

Myunghyun Ha, Krishna Srinivasan, Madhavan Swaminathan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Chip-package co-simulation is required to predict the interaction between the chip and package at the system level. The FDTD method can be used to analyze these structures but is limited by the Courant condition. In this paper, an alternate method is suggested by combining Laguerre Polynomials with the FDTD method. Since, the solution is implicit, the Courant condition is no longer an issue and therefore the method provides unconditional stability. In addition, the time domain response can be computed similar to the FDTD scheme. The formulation allows the conversion of an electromagnetic problem to a circuit representation with resistors, voltage and current sources. Such a representation is useful since a DC solution can be used to obtain the transient response. To obtain the low frequency response using an FDTD based method, computing the time domain response over long time duration is required. Due to the behavior of the Laguerre Polynomials, this can be difficult. In this paper, computing the time domain response over several micro-seconds is discussed using Laguerre Polynomials combined with the FDTD scheme. This method now can be applied to compute the frequency response from DC to very high frequencies for multi-scale structures arising in chip-package co-simulation.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 2008
Pages339-342
Number of pages4
DOIs
StatePublished - 2008
Event17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008 - San Jose, CA, United States
Duration: Oct 27 2008Oct 29 2008

Publication series

NameElectrical Performance of Electronic Packaging, EPEP

Conference

Conference17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Country/TerritoryUnited States
CitySan Jose, CA
Period10/27/0810/29/08

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Chip-package co-simulation with multiscale structures'. Together they form a unique fingerprint.

Cite this