Chip-package electrical interaction in organic packages with embedded actives

Nithya Sankaran, Hunter Chan, Madhavan Swaminathan, Venky Sundaram, Rao Tummala, Telesphor Kamgaing, Vijay K. Nair

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

System integration and miniaturization needs are the driving factors for embedding active and passive components within packages. But embedding components also results in unwanted interferences within the package. This paper demonstrates chip-package interaction in the form of electromagnetic interference between the embedded chip and its package. The electromagnetic coupling experienced by the bond-pads of the embedded chip, the effect of bulk substrate of the embedded chip on the coupling across the package and the influence of die to cavity clearance on the vertical electromagnetic coupling across the different layers of the package housing the embedded chip are analyzed. Results from simulations and measurements are presented to demonstrate the phenomena studied.

Original languageEnglish (US)
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages150-156
Number of pages7
DOIs
StatePublished - 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: May 31 2011Jun 3 2011

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference2011 61st Electronic Components and Technology Conference, ECTC 2011
Country/TerritoryUnited States
CityLake Buena Vista, FL
Period5/31/116/3/11

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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