TY - GEN
T1 - Chip-package electrical interaction in organic packages with embedded actives
AU - Sankaran, Nithya
AU - Chan, Hunter
AU - Swaminathan, Madhavan
AU - Sundaram, Venky
AU - Tummala, Rao
AU - Kamgaing, Telesphor
AU - Nair, Vijay K.
PY - 2011
Y1 - 2011
N2 - System integration and miniaturization needs are the driving factors for embedding active and passive components within packages. But embedding components also results in unwanted interferences within the package. This paper demonstrates chip-package interaction in the form of electromagnetic interference between the embedded chip and its package. The electromagnetic coupling experienced by the bond-pads of the embedded chip, the effect of bulk substrate of the embedded chip on the coupling across the package and the influence of die to cavity clearance on the vertical electromagnetic coupling across the different layers of the package housing the embedded chip are analyzed. Results from simulations and measurements are presented to demonstrate the phenomena studied.
AB - System integration and miniaturization needs are the driving factors for embedding active and passive components within packages. But embedding components also results in unwanted interferences within the package. This paper demonstrates chip-package interaction in the form of electromagnetic interference between the embedded chip and its package. The electromagnetic coupling experienced by the bond-pads of the embedded chip, the effect of bulk substrate of the embedded chip on the coupling across the package and the influence of die to cavity clearance on the vertical electromagnetic coupling across the different layers of the package housing the embedded chip are analyzed. Results from simulations and measurements are presented to demonstrate the phenomena studied.
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U2 - 10.1109/ECTC.2011.5898506
DO - 10.1109/ECTC.2011.5898506
M3 - Conference contribution
AN - SCOPUS:79960410658
SN - 9781612844978
T3 - Proceedings - Electronic Components and Technology Conference
SP - 150
EP - 156
BT - 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
T2 - 2011 61st Electronic Components and Technology Conference, ECTC 2011
Y2 - 31 May 2011 through 3 June 2011
ER -