@inproceedings{f7c56cf4a89a447a8a5c8124bbe4fcbd,
title = "Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines",
abstract = "Co/Cu composite interconnect systems were studied. Since wide Cu lines require a diffusion barrier which is simultaneously applied also to fine Co lines to reduce Co volume fraction, through-Cobalt Self-Formed-Barrier (tCoSFB) was employed to thin down TaN barrier to <1 nm which works as an adhesion layer for Co lines. Line R of fine Co lines was reduced by 30\% successfully. The Co/tCoSFB-Cu composite interconnect system is promising to achieve low line R for both fine and wide lines simultaneously in 7nm BEOL and beyond.",
author = "T. Nogami and R. Patlolla and J. Kelly and B. Briggs and H. Huang and J. Demarest and J. Li and R. Hengstebeck and X. Zhang and G. Lian and B. Peethala and P. Bhosale and J. Maniscalco and H. Shobha and S. Nguyen and P. McLaughlin and T. Standaert and D. Canaperi and D. Edelstein and V. Paruchuri",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 2017 IEEE International Interconnect Technology Conference, IITC 2017 ; Conference date: 16-05-2017 Through 18-05-2017",
year = "2017",
month = jul,
day = "5",
doi = "10.1109/IITC-AMC.2017.7968961",
language = "English (US)",
series = "IITC 2017 - 2017 IEEE International Interconnect Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "IITC 2017 - 2017 IEEE International Interconnect Technology Conference",
address = "United States",
}