TY - JOUR
T1 - Cold sintering-enabled interface engineering of composites for solid-state batteries
AU - Nie, Bo
AU - Liu, Tengxiao
AU - Alcoutlabi, Mataz
AU - Basu, Saurabh
AU - Kumara, Soundar
AU - Li, Mingxin
AU - Lian, Jie
AU - Sun, Hongtao
N1 - Publisher Copyright:
Copyright © 2023 Nie, Liu, Alcoutlabi, Basu, Kumara, Li, Lian and Sun.
PY - 2023
Y1 - 2023
N2 - The cold sintering process (CSP) is a low-temperature consolidation method used to fabricate materials and their composites by applying transient solvents and external pressure. In this mechano-chemical process, the local dissolution, solvent evaporation, and supersaturation of the solute lead to “solution-precipitation” for consolidating various materials to nearly full densification, mimicking the natural pressure solution creep. Because of the low processing temperature (<300°C), it can bridge the temperature gap between ceramics, metals, and polymers for co-sintering composites. Therefore, CSP provides a promising strategy of interface engineering to readily integrate high-processing temperature ceramic materials (e.g., active electrode materials, ceramic solid-state electrolytes) as “grains” and low-melting-point additives (e.g., polymer binders, lithium salts, or solid-state polymer electrolytes) as “grain boundaries.” In this minireview, the mechanisms of geomimetics CSP and energy dissipations are discussed and compared to other sintering technologies. Specifically, the sintering dynamics and various sintering aids/conditions methods are reviewed to assist the low energy consumption processes. We also discuss the CSP-enabled consolidation and interface engineering for composite electrodes, composite solid-state electrolytes, and multi-component laminated structure battery devices for high-performance solid-state batteries. We then conclude the present review with a perspective on future opportunities and challenges.
AB - The cold sintering process (CSP) is a low-temperature consolidation method used to fabricate materials and their composites by applying transient solvents and external pressure. In this mechano-chemical process, the local dissolution, solvent evaporation, and supersaturation of the solute lead to “solution-precipitation” for consolidating various materials to nearly full densification, mimicking the natural pressure solution creep. Because of the low processing temperature (<300°C), it can bridge the temperature gap between ceramics, metals, and polymers for co-sintering composites. Therefore, CSP provides a promising strategy of interface engineering to readily integrate high-processing temperature ceramic materials (e.g., active electrode materials, ceramic solid-state electrolytes) as “grains” and low-melting-point additives (e.g., polymer binders, lithium salts, or solid-state polymer electrolytes) as “grain boundaries.” In this minireview, the mechanisms of geomimetics CSP and energy dissipations are discussed and compared to other sintering technologies. Specifically, the sintering dynamics and various sintering aids/conditions methods are reviewed to assist the low energy consumption processes. We also discuss the CSP-enabled consolidation and interface engineering for composite electrodes, composite solid-state electrolytes, and multi-component laminated structure battery devices for high-performance solid-state batteries. We then conclude the present review with a perspective on future opportunities and challenges.
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U2 - 10.3389/fenrg.2023.1149103
DO - 10.3389/fenrg.2023.1149103
M3 - Short survey
AN - SCOPUS:85149644032
SN - 2296-598X
VL - 11
JO - Frontiers in Energy Research
JF - Frontiers in Energy Research
M1 - 1149103
ER -