TY - GEN
T1 - Compact electromagnetic bandgap structure for noise suppression in power plane
AU - Patnam, Hanumantha Rao
AU - Karunakaran, S.
AU - Swaminathan, Madhavan
PY - 2008
Y1 - 2008
N2 - A compact reduced size new Electromagnetic Bandgap (EBG) structure with the combination of AIEBG and multiple narrow slits in power plane is presented. Low on-set frequency is realized by concatenating 2x2 high frequency unit cells into a low frequency EBG unit cell without changing the over all dimensions of the EBG. Newly designed EBG operates over a frequency band of 0.9 GHz to 3.5 GHz with a good isolation of better than -40 dB over the band with 2x2 unitcells. The impedance of the structure is also presented, which is less than one ohm over the stop band of the EBG. Both the simulation and the measured results are compared and presented.
AB - A compact reduced size new Electromagnetic Bandgap (EBG) structure with the combination of AIEBG and multiple narrow slits in power plane is presented. Low on-set frequency is realized by concatenating 2x2 high frequency unit cells into a low frequency EBG unit cell without changing the over all dimensions of the EBG. Newly designed EBG operates over a frequency band of 0.9 GHz to 3.5 GHz with a good isolation of better than -40 dB over the band with 2x2 unitcells. The impedance of the structure is also presented, which is less than one ohm over the stop band of the EBG. Both the simulation and the measured results are compared and presented.
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U2 - 10.1109/EDAPS.2008.4735986
DO - 10.1109/EDAPS.2008.4735986
M3 - Conference contribution
AN - SCOPUS:60649087798
SN - 9781424426331
T3 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
SP - 13
EP - 15
BT - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
T2 - 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Y2 - 10 December 2008 through 12 December 2008
ER -