TY - GEN
T1 - Compiler-directed power density reduction in NoC-based multicore designs
AU - Narayanan, Sri Hari Krishna
AU - Kandemir, Mahmut
AU - Ozturk, Ozcan
PY - 2006
Y1 - 2006
N2 - As transistor counts keep increasing and clock frequencies rise, high power consumption is becoming one of the most important obstacles, preventing further scaling and performance improvements. While high power consumption brings many problems with it, high power density and thermal hotspots are maybe two of the most important ones. Current architectures provide several circuit based solutions to cope with thermal emergencies when they occur but exercising them frequently can lead to significant performance losses. This paper proposes a compiler-based approach that balances the computational workload across the processors of a NoC based chip multiprocessor such that the chances of experiencing a thermal emergency at runtime are reduced. Our results show that the proposed approach cuts the number of runtime thermal emergencies by 42% on the average on benchmarks tested.
AB - As transistor counts keep increasing and clock frequencies rise, high power consumption is becoming one of the most important obstacles, preventing further scaling and performance improvements. While high power consumption brings many problems with it, high power density and thermal hotspots are maybe two of the most important ones. Current architectures provide several circuit based solutions to cope with thermal emergencies when they occur but exercising them frequently can lead to significant performance losses. This paper proposes a compiler-based approach that balances the computational workload across the processors of a NoC based chip multiprocessor such that the chances of experiencing a thermal emergency at runtime are reduced. Our results show that the proposed approach cuts the number of runtime thermal emergencies by 42% on the average on benchmarks tested.
UR - http://www.scopus.com/inward/record.url?scp=84863842344&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84863842344&partnerID=8YFLogxK
U2 - 10.1109/ISQED.2006.36
DO - 10.1109/ISQED.2006.36
M3 - Conference contribution
AN - SCOPUS:84863842344
SN - 0769525237
SN - 9780769525235
T3 - Proceedings - International Symposium on Quality Electronic Design, ISQED
SP - 570
EP - 575
BT - Proceedings - 7th International Symposium on Quality Electronic Design, ISQED 2006
T2 - 7th International Symposium on Quality Electronic Design, ISQED 2006
Y2 - 27 March 2006 through 29 March 2006
ER -