Computation of the frequency response of multiple planes in gigahertz packages and boards

Jinseong Choi, Madhavan Swaminathan

Research output: Contribution to conferencePaperpeer-review

5 Scopus citations

Abstract

This paper discusses a simple and efficient method for computing the frequency response of a plane pair stack-up in multi-layered packages and boards. This method is suitable for high speed digital systems where skin effect approximation is valid. The results have been compared to S-parameter measurements and show good correlation in the frequency range 50 MHz-1 GHz. The effect of decoupling capacitors on the frequency response have also been computed.

Original languageEnglish (US)
Pages157-160
Number of pages4
StatePublished - 1999
EventProceedings of the 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA
Duration: Oct 25 1999Oct 27 1999

Conference

ConferenceProceedings of the 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging
CitySan Diego, CA, USA
Period10/25/9910/27/99

All Science Journal Classification (ASJC) codes

  • General Engineering

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