Abstract
This paper discusses a simple and efficient method for computing the frequency response of a plane pair stack-up in multi-layered packages and boards. This method is suitable for high speed digital systems where skin effect approximation is valid. The results have been compared to S-parameter measurements and show good correlation in the frequency range 50 MHz-1 GHz. The effect of decoupling capacitors on the frequency response have also been computed.
| Original language | English (US) |
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| Pages | 157-160 |
| Number of pages | 4 |
| State | Published - 1999 |
| Event | Proceedings of the 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA Duration: Oct 25 1999 → Oct 27 1999 |
Conference
| Conference | Proceedings of the 1999 8th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | San Diego, CA, USA |
| Period | 10/25/99 → 10/27/99 |
All Science Journal Classification (ASJC) codes
- General Engineering