TY - GEN
T1 - Computationally efficient thermal simulation with micro-fluidic cooling for 3D integration
AU - Xie, Jianyong
AU - Swaminathan, Madhavan
PY - 2011
Y1 - 2011
N2 - In 3D system design, effective thermal cooling for high power density 3D stacked ICs is a crucial bottleneck. In this paper, efficient thermal simulation with micro-channel fluidic cooling and air convection boundary condition is presented. By employing the analytical model for micro-fluidic cooling, the fluid flow rate can be efficiently optimized to achieve target chip temperatures. Results demonstrating the efficiency and scalability of the method have been presented. In particular, the algorithm shows good capability of analyzing 3D stacking of chips with more than 20 micro-channels and hundreds of TSVs.
AB - In 3D system design, effective thermal cooling for high power density 3D stacked ICs is a crucial bottleneck. In this paper, efficient thermal simulation with micro-channel fluidic cooling and air convection boundary condition is presented. By employing the analytical model for micro-fluidic cooling, the fluid flow rate can be efficiently optimized to achieve target chip temperatures. Results demonstrating the efficiency and scalability of the method have been presented. In particular, the algorithm shows good capability of analyzing 3D stacking of chips with more than 20 micro-channels and hundreds of TSVs.
UR - http://www.scopus.com/inward/record.url?scp=84864272156&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84864272156&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2011.6213803
DO - 10.1109/EDAPS.2011.6213803
M3 - Conference contribution
AN - SCOPUS:84864272156
SN - 9781467322881
T3 - 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
BT - 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
T2 - 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
Y2 - 12 December 2011 through 14 December 2011
ER -