COMPUTER-CONTROLLED ULTRASONIC ADHESIVE BOND EVALUATION.

Jack W. Raisch, Joseph L. Rose

Research output: Contribution to specialist publicationArticle

8 Scopus citations

Abstract

An inspection procedure for a metal-to-metal step-lap joint problem is presented. Rather than study the mechanics of bonding and the relationship of performance to many manufacturing and service variables, it is proposed to examine the potential of selected ultrasonic signal features and their ability to predict performance of an adhesively bonded structure. Emphasis is placed on studying the nondisbond problem. A completely automated data acquisition and analysis procedure is utilized in this study.

Original languageEnglish (US)
Pages55-64
Number of pages10
Volume37
No6
Specialist publicationMaterials Evaluation
StatePublished - May 1979

All Science Journal Classification (ASJC) codes

  • General Materials Science
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'COMPUTER-CONTROLLED ULTRASONIC ADHESIVE BOND EVALUATION.'. Together they form a unique fingerprint.

Cite this