Continuing development of a laser line forming system

Edward William Reutzel, J. U. Aburdene, K. J. Gombotz, J. P. Magnusen, Richard Martukanitz, P. Michaleris, L. Zhang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Thermal-mechanical processing by laser radiation has been shown effective in forming plates into relatively complex shapes at sufficient production rates. An iterative approach that incorporates sensing and contro techniques in order to converge to the desired shape may prove effective in overcoming shortcomings in predietivi models and inconsistencies in plate materials obtained during production. This presentation will discuss the continuing development of a prototype integrated system, and techniques necessary to achieve shaping of complex components by the laser assisted forming process. Integration of the robotics and laser displacement sensor into the user-friendly, modularized software platform is discussed. Path planning algorithm development is presented, witl special attention to optimization techniques based on both single-line heats, and on a strategy that uses batch lins processing with batch parameters dependent on the shape type. Preliminary experimental results will be presented.

Original languageEnglish (US)
Title of host publicationICALEO 2002 - 21st International Congress on Applications of Laser and Electro-Optics, Congress Proceedings
StatePublished - Dec 1 2002
EventICALEO 2002 - 21st International Congress on Applications of Laser and Electro-Optics - Scottsdale, AZ, United States
Duration: Oct 14 2002Oct 17 2002

Publication series

NameICALEO 2002 - 21st International Congress on Applications of Laser and Electro-Optics, Congress Proceedings

Other

OtherICALEO 2002 - 21st International Congress on Applications of Laser and Electro-Optics
Country/TerritoryUnited States
CityScottsdale, AZ
Period10/14/0210/17/02

All Science Journal Classification (ASJC) codes

  • Geochemistry and Petrology
  • Electrical and Electronic Engineering

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