TY - GEN
T1 - Core vs. uncore
T2 - 52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015
AU - Cheng, Hsiang Yun
AU - Zhan, Jia
AU - Zhao, Jishen
AU - Xie, Yuan
AU - Sampson, Jack
AU - Irwin, Mary Jane
N1 - Publisher Copyright:
© 2015 ACM.
PY - 2015/7/24
Y1 - 2015/7/24
N2 - Even though Moore's Law continues to provide increasing transistor counts, the rise of the utilization wall limits the number of transistors that can be powered on and results in a large region of dark silicon. Prior studies have proposed energy-efficient core designs to address the 'dark silico' problem. Nevertheless, the research for addressing dark silicon challenges in uncore components, such as shared cache, on-chIP interconnect, etc, that contribute significant on-chIP power consumption is largely unexplored. In this paper, we first illustrate that the power consumption of uncore components cannot be ignored to meet the chIP's power constraint. We then introduce techniques to design energy-efficient uncore components, including shared cache and on-chIP interconnect. The design challenges and opportunities to exploit 3D techniques and non-volatile memory (NVM) in dark-silicon-aware architecture are also discussed.
AB - Even though Moore's Law continues to provide increasing transistor counts, the rise of the utilization wall limits the number of transistors that can be powered on and results in a large region of dark silicon. Prior studies have proposed energy-efficient core designs to address the 'dark silico' problem. Nevertheless, the research for addressing dark silicon challenges in uncore components, such as shared cache, on-chIP interconnect, etc, that contribute significant on-chIP power consumption is largely unexplored. In this paper, we first illustrate that the power consumption of uncore components cannot be ignored to meet the chIP's power constraint. We then introduce techniques to design energy-efficient uncore components, including shared cache and on-chIP interconnect. The design challenges and opportunities to exploit 3D techniques and non-volatile memory (NVM) in dark-silicon-aware architecture are also discussed.
UR - http://www.scopus.com/inward/record.url?scp=84944088466&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84944088466&partnerID=8YFLogxK
U2 - 10.1145/2744769.2647916
DO - 10.1145/2744769.2647916
M3 - Conference contribution
AN - SCOPUS:84944088466
T3 - Proceedings - Design Automation Conference
BT - 2015 52nd ACM/EDAC/IEEE Design Automation Conference, DAC 2015
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 7 June 2015 through 11 June 2015
ER -