TY - GEN
T1 - Correlated effects of self-heating, light output, and efficiency of GaN light-emitting diodes on junction temperature
AU - Chatterjee, Bikramjit
AU - Lundh, James Spencer
AU - Shoemaker, Daniel
AU - Kim, Tae Kyoung
AU - Kwak, Joon Seop
AU - Cho, Jaehee
AU - Choi, Sukwon
N1 - Funding Information:
Funding for efforts by the Pennsylvania State University was provided by the AFOSR Young Investigator Program (Grant No. FA9550-17-1-0141, Program Officers: Dr. Michael Kendra and Dr. Brett Pokines, also monitored by Dr. Kenneth Goretta). The author at Chonbuk National University acknowledges the support by the basic science research program through the National Research Foundation (NRF) of Korea funded by the Ministry of Education (No. 2017R1D1A1A09000684). Authors at Sunchon National University acknowledge the support by the Basic Science Research Program through the National Research Foundation of Korea (NRF-2014R1A6A1030419 and NRF-2018R1D1A3A03000779).
Publisher Copyright:
Copyright © 2019 ASME.
PY - 2019
Y1 - 2019
N2 - With the advent of GaN as the major material system in the solid-state lighting industry—high power, high brightness LEDs with wavelength ranging from near UV to white are getting fabricated and part of a tremendously large and ever-increasing market. However, device self-heating and environment temperature significantly deteriorates the LED’s optical performance. Hence, it is extremely important to quantify the device self-heating and its impact on optical performance. In this work, three different characterization techniques were used to calculate temperature rise due to self-heating for an InGaN/GaN LED with 5 pairs of multiple quantum wells. The impact of self-heating and increased environment temperature on the device optical performance were also studied. Nanoparticle assisted Raman thermometry was used for the first time to measure the LED mesa surface temperature. The temperature measured using this technique was compared with temperature data obtained by using the forward voltage method and infrared (IR) thermography. The IR and Raman measurement results were in close agreement while the temperature data obtained from forward voltage method underestimated the temperature by 5-10%. It was also observed that due to environment temperature increase from 25ºC to 100ºC, LED optical power output drops by 12%.
AB - With the advent of GaN as the major material system in the solid-state lighting industry—high power, high brightness LEDs with wavelength ranging from near UV to white are getting fabricated and part of a tremendously large and ever-increasing market. However, device self-heating and environment temperature significantly deteriorates the LED’s optical performance. Hence, it is extremely important to quantify the device self-heating and its impact on optical performance. In this work, three different characterization techniques were used to calculate temperature rise due to self-heating for an InGaN/GaN LED with 5 pairs of multiple quantum wells. The impact of self-heating and increased environment temperature on the device optical performance were also studied. Nanoparticle assisted Raman thermometry was used for the first time to measure the LED mesa surface temperature. The temperature measured using this technique was compared with temperature data obtained by using the forward voltage method and infrared (IR) thermography. The IR and Raman measurement results were in close agreement while the temperature data obtained from forward voltage method underestimated the temperature by 5-10%. It was also observed that due to environment temperature increase from 25ºC to 100ºC, LED optical power output drops by 12%.
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U2 - 10.1115/IPACK2019-6426
DO - 10.1115/IPACK2019-6426
M3 - Conference contribution
AN - SCOPUS:85084162381
T3 - ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
BT - ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019
Y2 - 7 October 2019 through 9 October 2019
ER -